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Global and China PCB Industry Report, 2010

No:yb10-1486   China Report Hall   [Print]   [Recommend to friend]

[Report Title]: Global and China PCB Industry Report, 2010

[Keywords]: PCB Industry

[Date]: June 2010

[Delivery]: EMAIL electronic version or EMS Speedpost

[Paginated]: Pages 153

[Price]:Hardcopy 2200 USD Electronic 2400 USD Enterprisewide 3600 USD

[Telephone Order]:0592-5337135/5337136    Online Order

[Report Contents]


  
1. Application of PCB
1.1 Mobile Phone PCB Industry
1.2 PCB for Memory Module
1.3 PCB for Photovoltaic Panel
1.4 PCB for Notebook and DV
1.5 PCB for Automobile Electronics 

2. PCB Industry
2.1 PCB Industry Chain
2.2 PCB Industry Review in 2009 and Outlook in 2010
2.3 Technology Pattern of PCB Industry
2.4 Geographical Pattern of PCB Industry
2.5 PCB Industry in Taiwan
2.6 PCB Industry in Mainland China
2.7 FPC Market Scale
2.8 FPC Industry Chain
2.9 Geographical Distribution of FPC Industry
2.10 Relationship between FPC Customers and Suppliers
2.11 Ranking in FPC Industry
2.12 Ranking in PCB Industry 

3. Typical PCB Manufacturers 
3.1 Samsung Electro 
3.2 AT&S 
3.3 Guangdong Goworld Co., Ltd
3.3.1 Profile and Operation 
3.3.2 Business Development Advantages 
3.3.3 Development Trends, 2010 
3.4 Aspocomp 
3.5 Founder PCB 
3.6 Meiko Electronics Co., Ltd
3.7 Meadville Group 
3.8 Unimicron 
3.9 COMPEQ MANUFACTURING CO., LTD
3.10 Unitech 
3.11 WUS Printed Co., Ltd
3.12 GOLD CIRCUIT ELECTRONICS LTD 
3.13 Chin Poon Industrial Co., Ltd
3.14 Tripod Technology Corporation 
3.15 PLOTECH TECHNOLOGY 
3.16 HannStar Board Co., Ltd 
3.17 Tianjin Printronics Circuit Corp 
3.18 Kingboard Chemical Holdings Ltd 
3.19 DYnamic Electronics Cp., Ltd
3.20 TAIWAN PCB TECHVEST CO.,LTD 
3.21 Viasystems Group Inc 
3.22 Daisho Microline Limited
3.23 IBIDEN CO.,LTD

Selected Charts 
Technology Trends of Mobile Phone PCB
Mobile Phone PCB Suppliers of Apple, 2009
Mobile Phone PCB Suppliers of RIM, 2009
Mobile Phone PCB Suppliers of Nokia, 2006,2009
Mobile Phone PCB Suppliers of Samsung, 2006,2009
Mobile Phone PCB Suppliers of LG, 2006,2009
PCB Suppliers of Major Mobile Phone Manufacturers 
Market Shares of Mobile Phone PCB Manufacturers by Revenue, 2009
Market Shares of Major Memory PCB Suppliers, 2006,2009
Market Shares of Major Photovoltaic Panel Manufacturers in Taiwan, 2006, 2009 
Technical Roadmap of Notebook PCB
Market Shares of Major Notebook PCB Manufacturers in the World, 2006, 2009
Cost Structure of CCL Industry and PCB Industry
Global PCB Output Value, 1997-2009 
Global PCB Shipment and Average Price, 1999-2009
Global PCB Output Value, 1997-2011 
Global PCB Downstream Application, 2000, 2009 
Global PCB Product Structure, 2000, 2009 
Geographic Distribution of Global PCB Output Value, 2006-2011
PCB Output Value of Taiwan, 2007-2012 
Distribution of Taiwans PCB Output Value by Region, 2008-2010 
Distribution of Taiwans PCB Output Value by Technology, 2009
PCB Market Scale in Mainland China, 2007-2012 
Geographic Distribution of PCB Industry in Mainland China by Output Value, 2008-2010
PCB Market Segments in Mainland China , 2008-2010
PCB Downstream Applications in Mainland China, 2008-2010
FPC Market Scale, 2007-2013
Downstream Distribution of FPC Market, 2007-2013 
FPC Industry Chain in Taiwan
Geographic Distribution of FPC Industry (by Location of Corporate Headquarters), 2009
Geographic Distribution of FPC Industry (by Place of Production), 2009 
Ranking of FPC Manufacturers in Japan
Ranking of FPC Manufacturers in South Korea
Ranking of FPC Manufacturers in Taiwan
Ranking of FPC Manufacturers in Mainland China and Hong Kong
Top 20 PCB Manufacturers in the World by Income, 2004-2008
Ranking of Top 18 PCB Manufacturers in the World, 2009
Ranking of Top 20 PCB Manufacturers in Taiwan, 2009
Sales and Gross Profit of Samsung Electro-Mechanics, 2009-Q1 2010
Revenue Structure of Samsung Electro-Mechanics by Division, Q1 2010 
Revenue Structure of ACI Division of Samsung Electro-Mechanics, Q1 2010
Revenue Structure of LCR Division of Samsung Electro-Mechanics, Q1 2010
Revenue Structure of OMS Division of Samsung Electro-Mechanics, Q1 2010
Revenue Structure of CDS Division of Samsung Electro-Mechanics, Q1 2010
Financial Data of AT&S, Q4 2009 
Revenue of AT&S by Division, FY2006-FY2009
Revenue of AT&S by Region, FY2008-FY2009 
Business Performance of AT&S in Austria, FY2008-FY2009 
Business Performance of AT&S in Asia-Pacific, FY2008-FY2009  
Operating Income of Goworld, 2007-2009
Quarterly Net Profit of Goworld, 2007-2009
Revenue of Goworld by Product and by Region, 2009 
Operating Income and Gross Profit of Aspocomp, Q4 2008-Q4 2009
Organizational Structure of Founders PCB Industry
Founders PCB Industry Layout 
Specifications of Founders PCB HDI 
Specifications of Founders PCB Backplane & Line Card 
Specifications of Founders PCB Backplane & Line Card 
Specifications of Founders Gold Finger PCBs 
Specifications of Founders PCB Substrate 
Development of Meiko 
Global Business Scope of Meiko Electronics
Revenue and Gross Profit of Meiko Electronics, Q4 2008- Q4 2009 
Revenue of Meiko Electronics by Region, Q3 2009 
Revenue of Meiko Electronics by Application, Q2-Q3 2009
PCB Revenue of Meiko Electronics by Layer Count, Q2-Q3 2009
Meadville Group Technology Roadmap for Conventional PCB 
Meadville Group Technology Roadmap for HDI PCB 
Meadville Group Technology Roadmap for IC Substrate 
Financial Data of Meadville Group, H1 2009
Meadville Group Revenue by Layer Count, 2004-2008 
Meadville Group Revenue by Application, 2004-2008
Unimicrons Revenue, 1990-2009 
Unimicrons Profit Margin, 1995-Q1 2009
Unimicrons Position in the World 
Unimicrons Organizational Structure
Unimicrons Technology Roadmap 
Operating Income of Unimicron by Product, 2009 
Unimicrons Plants 
Production Capacity of Unimicron by Product, 2006-end of 2009 
Application of Unimicrons Products, 2007-2009 
COMPEQ General Capabilities Product Types
COMPEQ HDI Product Types 
COMPEQ High Layer Count / Regular Product Types 
COMPEQ Rigid-Flex Product Types 
COMPEQ Flex Product Types 
Revenue and Gross Profit of COMPEQ, 2004-2008 
COMPEQ Branches Worldwide 
Application of COMPEQs Products, 2004-2008 
Output Value and Output of COMPEQ, 2007-2008 
Sales Volume and Sales Revenue of COMPEQ, 2007-2008 
R&D Investment of COMPEQ, 2004-Q1 2009 
COMPEQ Employees in Taiwan 
Roadmap for Unitechs Mobile Phone Technology 
Roadmap for Unitechs Rigid-Flex Technology 
Revenue and Net Profit of Unitech, 2007-2009 
Monthly Operating Income of Unitech, 2008-2010
Operating Income of Unitech by Product (by Layer Count), 2008 
Sales Revenue of Unitech by Region, 2006-2008
WUS Capabilities of HDI
WUS Capabilities of RF Module 
WUS Capabilities of Multi-Layer 
Revenue and Gross Profit Margin of WUS, 2004-2009 
Income Statement of GCE, 2005-Q3 2009
Sales Revenue of GCE by Product, Q1 2009
Sales of GCEs Products by Region
Equipment of GCE
Production Capacity of GCE 
Monthly Revenue of Chin Poon, 2008-2010 
Organizational Structure of Chin Poon 
Revenue of Chin Poon by Region, 2006-2008
Production Capacity of Chin Poon by Plant (by Layer), 2009 
PCB Output Value of Chin Poon by Application, 2007-2009 
Sales Volume and Revenue of Main Products of Chin Poon, 2007-2008 
Monthly Revenue of Tripod Technology, 2007-2009 
Production Capacity Planning of Tripod Technology, 2009
Application of Products of Tripod Technology, 2009 
Products of Tripod Technology by Layer Count, 2009 
Revenue and Gross Profit of PLOTECH, 2004-2009 
PLOTECH Production Capabilities 
HDI Capability and Roadmap of HannStar Board 
Multi-Layer Board Capability and Roadmap of HannStar Board 
Application of Products of HannStar Board, Q1 2010
Revenue and Gross Profit of HannStar Board, 2005-2009 
Monthly Net Operating Income of HannStar Board, 2009-2010 
HannStar Boards Total Capacity, 2006-2010 
TPCs Production Process and Standard Capability 
Operating Income and Gross Profit of TPC, 2008-2010 
Organizational Structure of TPC 
Product Categories of TPC, 2006-H1 2009
Revenue and Gross Profit of Kingboard, 2006-2009 
Profit Structure of Kingboard, 2009 
PCB Revenue of Elec & Eltek by Region, 2008-2009 
PCB Revenue of Elec & Eltek by Layer Count, 2008 
PCB Revenue of Elec & Eltek by Layer Count, 2009
Dynamics Organizational Structure 
Dynamics Production Bases 
Dynamics Revenue, 2001-2009
Production Capacity Expansion Plan of Dynamic, 2009-2012 
Production Capacity Expansion Plan of Dynamic Taiwan, 2009-2012 
Production Capacity Expansion Plan of Dynamic Kunshan, 2009-2012
Production Capacity Expansion Plan of Dynamic Xiamen, 2009-2012 
Application of Dynamics Products, 2008-Q1 2009 
R&D Roadmap of Dynamic
Roadmap for Production Capacity of Dynamic
Regional Distribution of TPT's Business Network 
Major Clients of TPT
Monthly Operating Income and Growth Rate of TPT, 2007-2009
Operating Income of TPT by Product 
Application of TPTs Products 
Production Capacity Planning of TPT, 2007-2009 
Capital Expenditure and Production Capacity of TPT, 2005-2009
ViasystemsPCB Technology Roadmap for Capabilities and Processes 
Operating Income and Profit of Viasystems, 2005-2009 
Revenue of Viasystems by Region, 2007-2009
Application of Products of Viasystems, 2007-2009
Revenue of Viasystems by Application, 2008-2009
Major Clients of Viasystems by Revenue, 2009 
Operating Income of Daisho Microline, FY2007-FY2009 
Operating Income of Daisho Microline by Region, 2008-Q2, Q3 2009
Revenue of IBIDEN, FY2005-FY2009 
R&D Investment of IBIDEN, FY2006-FY2010 
Revenue of IBIDEN by Region, FY2009 
Sales of IBIDEN by Segment, FY2008 
Operating Income of CMK, FY2007-FY2009
Revenue of CMK (by Product), 2008-2009
Revenue of CMK (by Region), 2008-2009
Revenue of CMK (by Application), 2008-2009
Bases of CMK in China 
Sales Revenue of CMK (Wuxi), 2002-2008
Output of CMK (Wuxi), 2002-2008 
Application of CMK (Wuxi)s Products, 2008
Main Products of CMK (Wuxi) (by Layer)

 


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